Epson and Manz Asia collaborate for semiconductor manufacturing processes with inkjet technology

Seiko Epson Corporation and Manz Taiwan Ltd have announced a strategic collaboration to accelerate the adoption of inkjet technology in semiconductor manufacturing.

Through this collaboration, Epson will combine its high precision inkjet printhead technology with Manz Asia's expertise in the development of semiconductor related equipment and software. Together, the two companies aim to realise next generation semiconductor manufacturing processes based on inkjet technology.

An inkjet laboratory equipped with Epson printheads was established in November 2024 at the Manz Asia research and development centre in Taoyuan City, Taiwan. The laboratory supports customers, including semiconductor equipment manufacturers, by answering questions and consulting regarding inkjet based manufacturing process innovations and by printing samples and providing evaluation services.

Recently, the two companies agreed to a memorandum of understanding to further strengthen and advance their collaboration. In addition to research and evaluation applications, they agreed to develop equipment capable of supporting production scale manufacturing with mass production in mind. Through this enhanced partnership, they will begin full scale global deployment of next generation manufacturing technologies using inkjet technology.

Epson will support the laboratory's operation by leveraging its expertise from its own inkjet application laboratories, helping customers in process verification and preparations for volume production.

Inkjet printing technology enables maskless, high precision deposition and stacking of functional materials on semiconductor substrates such as silicon wafers and glass panels, making additive manufacturing possible within semiconductor production processes. Inkjet technology offers greater process flexibility, improved material utilisation efficiency, and reduced environmental impact than conventional fabrication processes.

The inkjet solutions, jointly developed by Epson and Manz Asia, will address a wide range of applications in semiconductor manufacturing processes, including advanced packaging where high reliability and efficiency are required, thereby contributing to enhanced device performance.

Robert Lin, CEO of Manz Asia, emphasised the strategic importance of the collaboration, saying: ‘Digital printing is transforming semiconductor manufacturing. Together with Epson, we combine advanced printhead technology with our equipment and process expertise to deliver a precise and scalable inkjet platform that enables semiconductor customers to validate process parameters across diverse applications and move seamlessly from research and development to high volume manufacturing.’

Shunya Fukuda, chief operating officer of Epson's IJS operations division, said: ‘Digital additive manufacturing using inkjet technology is expected to become a key technology supporting the evolution of semiconductor packaging. By leveraging Epson's high precision droplet control technology and volume production know how developed in the display and printed electronics fields, we will work together with Manz Asia to build a scalable manufacturing platform that bridges laboratory development and high volume production. Through this initiative, Epson aims to contribute to the sustainable development of the semiconductor industry.’

This collaboration represents a step toward more flexible and sustainable semiconductor manufacturing. The two companies will continue to support innovation in printed electronics and semiconductor manufacturing processes through inkjet technology.